Raj Varma, Delphon CTO, Delivers Technical Presentation on Bio-Inspired IC Carriers for MEPTEC Webinar
Hayward, CA, April 15, 2020: Delphon CTO Raj Varma delivered a technical presentation on bio-inspired carriers for a MEPTEC Semiconductor Industry Speaker Series Webinar.
Continuing market demands for our gadgets to be both smaller and smarter is putting an exponential demand on Integrated Circuits (IC) in terms of reliability, size, thickness and cost. The ICs used today are a lot smaller and thinner than what were used just a decade ago. Handling of such ICs is vital to a multitude of semiconductor applications such as MEMS, compound semiconductors, LEDs, fan-out WLP, CMOS image sensors (CIS), and most recently, 2.5D and 3D integration.
Molded Waffle Pack and JEDEC trays have reached their limit in handling such delicate devices, and are too slow to accommodate the frequently changing IC dimensions driven by constant consumer product refreshes and upgrades. More than ever, there is now a need for new tray solutions that can address such needs while maintaining compatibility with existing PnP, SMT and other automated handling machines.
Inspired by Gecko fibril microstructures, Gel-Pak developed different surface textures with reversible adhesion that are universal to IC dimensions, which involved tuning materials chemistry and fabrication process. The presentation will share the learnings throughout the development process and some of the challenges faced in scaling-up a nature concept to a commercial product. These textured have been successful scaled for few different form factors ranging from 2-inch Chip trays to as large as JEDEC trays, and could also be adapted to handle 300mm wafers.
Raj Varma is a specialist in materials development across a wide range of industries. He has over 25 years of experience in developing products for major brands such as Intel, Seagate, Motorola, Pepsi, Tyco, Gallo, Baxter, Alcoa, Gillette and Procter & Gamble. Raj has been with Gel-Pak since 2012 and has been driving its gel technology to a wide range of chemistries and product formats. He is responsible for upgrading Gel-Pak’s Analytical lab with state-of-the-art characterization capabilities, which include unique product specific metrologies. Raj is a Chemical Engineer, holds an M.S. in Polymer Engineering from the University of Akron, Ohio, and has an MBA from the Illinois Institute of Technology, Chicago. He has presented more than 20 papers at various international conferences and holds many U.S. as well as International patents.
Founded in 1980, Gel-Pak has developed a line of proprietary gel and elastomer coated device carriers and handling materials that offer solutions for applications where damage during handling must be avoided. The company's unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and patented Vacuum Release products. These products effectively immobilize devices during shipping and handling. For further information on Gel-Pak's product line, please refer to the website at www.gelpak.com.