Quik-Pak Installs New Ultra-fine Pitch Wire Bonder
Contact: Darby Davis
Phone: (510) 576-2220
9 A.M. EDT, February 12, 2008
San Diego, CA, January 30, 2008- Quik-Pak, a division of Delphon Industries, has announced the installation of a new Maxµm ultraTM Wire Bonder, the latest high performance automatic system offered by industry leader Kulicke & Soffa. This new wire bonder incorporates technological advancements that enable highly accurate assembly of integrated circuits with ultra fine pitch down to 35 microns
This new system complements Quik-Pak’s existing I.C. assembly equipment and broadens assembly capability to address the latest in advanced package and device designs. “As I.C. designs continually increase in complexity and decrease in feature size, the Maxµm ultraTM will enable us to meet the increased demands of our customers with ultra-fine pitch, stacked or multiple die and chip-on-board applications, “ stated Steve Swendrowski, Quik-Pak’s General Manager.
Background: Quik-Pak, a division of Delphon Industries, offers IC packages, assembly and prototype services. The company specializes in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages is available with no minimum quantity and can be provided as part of a turn-key assembly solution along with wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.