Quik-Pak Installs Ball Grid Array Process
9 A.M. EDT, April 11, 2007
SAN DIEGO, April 11 -- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new process line for Ball Grid Array(BGA)sphere attach. Quik-Pak offers initial BGA balling services, as well as rework of existing substrates, with SnPb or Pb-free sphere sizes ranging from 0.010” to 0.030” in diameter. The new in-house capability complements Quik-Pak's existing rapid turn IC assembly service offerings, which include die bonding, gold ball wire bonding, remolding and marking/branding. Quik-Pak is also the largest supplier of open cavity plastic packages, which allow IC designers to insert new die in existing production packages for design verification, testing and customer samples.
Background: Quik-Pak, a division of Delphon Industries, offers IC packages, assembly and prototype services. The company specializes in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages is available with no minimum quantity and can be provided as part of a turn-key assembly solution along with wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.