Quik-Pak Expands New Open-molded Plastic Package (OmPP) Product Family
Contact: Steve Swendrowski
9 A.M. EDT, June 1, 2011
San Diego, CA, June 1, 2011 - Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today its exclusive Open-molded Plastic Package (OmPP)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs.
Quik-Pak’s Ni/Au plated QFN‘s are offered in a broad assortment of body sizes from 3x3mm to 12x12mm with pitches including 0.40mm, 0.50mm and 0.80mm. Custom designs are available. Contact Quik-Pak for details.
Quik-Pak’s new OmPP packages are of unsurpassed quality and can be used in production beyond prototype builds. Most will be available for rapid delivery to meet customers’ timelines and specifications.
About Quik-Pak: The company specializes in microelectronic packaging and advanced assembly services. A limitless array of open-cavity and open molded packages are available with no minimum quantity. Packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, laser micromachining, remolding and marking/branding. Custom assembly expertise includes working with ceramic packages, flip chip die, chip-on-board, stacked die, radiation detectors and MEMS devices. Quik-Pak's unique offerings deliver faster time to market and reduced costs for new devices, while providing excellent flexibility, quality and customer service.
For more information Contact: Steve Swendrowski, Quik-Pak General Manager 1(858)674-4676 or Steves@icproto.com.