Quik-Pak Expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC
Contact: Casey Krawiec
Phone: (858) 521-3607
9 A.M. PST, September 18, 2012
San Diego, CA, September 18, 2012, - Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)™ product line. This 0.150” narrow body package is built to JEDEC standard MS-012 and is RoHS compliant. It is Ni/Au plated which is excellent for wire bonding. Quik-Pak’s 8-Lead SOIC has a standard 0.050” lead pitch and a superior sealing surface for air cavity applications.
Quik-Pak’s OmPP product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs. The company’s Openmolded packages offer flexibility and are ideal for prototype or production volume applications. Quik-Pak’s OmPP packages are production quality and are available for rapid delivery to meet customer’s timelines and specifications.
About Quik-Pak: The company specializes in microelectronic packaging and advanced assembly services. A limitless array of open-cavity and open molded packages are available with no minimum quantity. Packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for flip chip, ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced costs for new devices, while providing excellent flexibility, quality and customer service.
For More Information contact: Casey Krawiec: firstname.lastname@example.org or (858) 521-3607.