Quik-Pak Announces New Manufacturing Engineer
Contact: Steve Swendroski
99 A.M. EDT, August 1, 2007
SAN DIEGO, August 1, 2007-- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring David Arciaga, as Manufacturing Engineer. “David brings with him 23 years of experience in the semiconductor industry and will be an invaluable addition to our Manufacturing Team,” said Steve Swendrowski, General Manager of Quik-Pak. Mr. Arciaga previously worked for ten years at Texas Instruments, Baguio City, Philippines and for 13 years at Advanced Interconnect Technologies (AIT) Batam Island, Indonesia. David is married with three children and enjoys golfing, fishing, and swimming.
Background: Quik-Pak, a division of Delphon Industries, offers IC packages, assembly and prototype services. The company specializes in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages is available with no minimum quantity and can be provided as part of a turn-key assembly solution along with wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.