Quik-Pak Announces New BGA Service
Contact: Steve Swendroski
9 A.M. EDT, August 1, 2007
SAN DIEGO, August 1, 2007-- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring of Matt Rackstein, as Applications Engineering Manager. Mr. Rackstein brings with him a wealth of expertise in the field of design engineering and MEMS (Mirco Electro Mechanical Systems). Development. “Matt will make an excellent addition to our team. His vast experience in our market will help Quik-Pak better serve its customer especially in the areas of wafer backgrinding and dicing” said Steve Swendrowski, General Manager of Quik-Pak.
Matt has a BSEE degree from the University of Connecticut. He spent 20 years at Westinghouse starting as a design engineer and reaching the position of Senior Field Engineer responsible for all sales and customer service activities in his territory. His recent expertise is in MEMS (Micro Electro Mechanical Systems) development for automotive and aerospace applications. Matt is married with two children and enjoys boating, wake boarding, motor sports, and flying.
Background: Quik-Pak, a division of Delphon Industries, offers IC packages, assembly and prototype services. The company specializes in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages is available with no minimum quantity and can be provided as part of a turn-key assembly solution along with wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.