Quik-Pak adds Backgrinding Services
9 A.M. EDT, August 21, 2007
SAN DIEGO, August 21, 2007-- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the installation of a new Disco Automatic Surface Grinding system. This equipment provides in-house capability to grind wafers up to 200mm in diameter down to a thickness of 150µm (6 mils), supporting the latest package technology and stacked die applications. This newest capital acquisition, along with a Royce Pick & Place system, scheduled for September installation, complements the existing Disco Automatic Wafer Dicing Saw and allows Quik-Pak to deliver complete wafer preparation services. Quik-Pak is also the world’s largest supplier of open cavity plastic packages, that give IC designers the option to insert new die in existing production packages for design verification, testing and customer samples.
The new backgrinding service can be utilized either as part of Quik-Pak’s full turnkey packaging and assembly process or combined with wafer dicing and pick & place to provide complete wafer preparation services to customers with internal assembly capabilities.