Quik-Pak Promotes Casey Krawiec to Global Sales and Marketing Director
Contact: Darby Davis
Phone: 1 (510) 576-2227
9 A.M. EDT, April 30, 2014
San Diego, CA, April 30, 2014, Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director.
Mr. Krawiec joined Quik-Pak in 2011 as global sales and marketing manager and has been instrumental in setting the direction for the company’s growth. His background includes extensive experience in engineering and sales within the semiconductor industry. Previously, he held the position of vice president of North American Sales for StratEdge of San Diego and has held sales engineering and sales management positions at Kyocera America, San Diego, CA. Mr. Krawiec holds a Bachelor of Science degree in Mechanical Engineering from University of Kentucky and a MBA from the University of Louisville. “Casey will be a key player in directing Quik-Pak’s continued growth in the area of volume packaging and assembly services” said Darby Davis, vice president of sales and marketing for Quik-Pak’s parent company Delphon.
About Quik-Pak: Quik-Pak, a division of Delphon, provides IC packaging and assembly services. The company offers both custom open-molded plastic packages, and pre-molded plastic packages (OmPP.) Quik-Pak’s pre-molded plastic packages are cost-effective, come in a wide variety of sizes and lead counts, are available off the shelf, and are ideal for prototype or production volume applications. Quik-Pak also specializes in a variety of services that together provide a full turn-key packaging and assembly solution including wafer preparation, die/wire bonding, encapsulation and marking/branding all under one roof. Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die, MEMS, etc.