Gel-Pak’s new micro-textured film is featured in an article published in the July issue of Silicon Semiconductor
New Micro-textured Film Enables Universal Bare Die Carriers
By Raj Varma,
Delphon CTO
Jul 8, 2022
The emerging chiplet trend, which calls for the disaggregation of large monolithic functionality into interconnected smaller dies, offers significant advantages over the alternative system on chip (SoC). The move toward this technology has accentuated the need for known good die (KGD) that have been fully tested prior to integration into their final packaging. One challenge the industry faces in the test and assembly process is that conventional methods for handling chips can be problematic. A multitude of device dimensions and the need to pick and repick components or move them between processes calls for a more simplified way of handling these chiplets.