Gel‑Pak to Present Breakthrough Universal Micro‑Textured Carrier Technology at TestConX 2026

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Hayward, CA — February 25, 2026 — Gel‑Pak, a Delphon company and a leader in advanced device‑handling materials, announced today that Dr. Jerry Broz will deliver a featured presentation at TestConX 2026, taking place March 1–4 in Mesa, Arizona. The presentation, titled “Enhancing OEE & Reducing Costs for KGD Handling using Universal Micro‑Textured Carrier Strategies,” will highlight new innovations designed to address critical challenges in advanced semiconductor test and assembly environments.

As the electronics industry rapidly advances toward heterogeneous integration, chiplet architectures, and increasingly diverse device form factors, traditional custom‑molded trays and handling media have become costly, inflexible, and operationally limiting. Gel‑Pak’s newly engineered universal micro‑textured carrier trays offer a transformative alternative by eliminating the need for device‑specific pockets and enabling highly reliable, repeatable handling of Known Good Die (KGD) across multiple process steps.

“High‑value semiconductor devices demand precise, contamination‑free handling throughout test and assembly,” said Dr. Jerry Broz, who leads Business Development and Strategic Marketing for Gel‑Pak. “Our micro‑textured universal carrier technology is engineered to reduce handling‑induced defects, streamline inventory, and significantly improve operational efficiency across diverse product lines.”


Key Advantages of the New Universal Carrier Solution

  • Micro‑textured film surface engineered for optimal holding force and controlled release.
  • Pocketless universal format, eliminating costly custom tooling for each device size.
  • Less than 2% device contact area, minimizing risk of contamination.
  • Compatibility with automated test and assembly equipment, improving throughput and reducing downtime.
  • Scalable integration across singulated die test, in‑process handling, binning, and pre‑assembly kitting.

The presentation will also include a case study demonstrating how micro‑textured universal carriers outperform legacy waffle packs, tape‑and‑reel systems, and custom pocketed trays in environments requiring flexibility, cleanliness, and reliability.

TestConX attendees will have the opportunity to engage with Gel‑Pak representatives to learn how universal carriers support evolving packaging strategies, reduce operational costs, and enhance die integrity across heterogenous integration workflows.


Event Details

  • Presentation: Enhancing Operational Efficiency & Reducing Costs in Known Good Die Handling with Universal Micro‑Textured Carrier Trays
  • Speaker: Dr. Jerry Broz, Gel‑Pak
  • Conference: TestConX 2026
  • Dates: March 1–4, 2026
  • Location: Mesa, Arizona

About Gel‑Pak

For over 45 years, Gel‑Pak has partnered with high‑technology companies to create advanced materials and device‑handling solutions that protect, transport, and process high‑value components. From delicate semiconductor die to photonics, medical devices, and precision‑engineered parts, Gel‑Pak products are trusted worldwide for their quality, reliability, and performance.

As part of Delphon, Gel‑Pak leverages deep expertise in elastomer engineering, cleanroom manufacturing, and global materials innovation to support customers that are transforming the world.