Gel-Pak Sr. Director of R&D featured in Semiconductor Engineering Article

We’re thrilled to see our very own Victoria Tran, Sr. Director of R&D at Gel-Pak, featured in the latest Semiconductor Engineering article: 𝙏𝙝𝙚 𝙃𝙞𝙙𝙙𝙚𝙣 𝘾𝙤𝙨𝙩 𝙤𝙛 𝘾𝙤𝙣𝙩𝙖𝙘𝙩 𝙍𝙚𝙨𝙞𝙨𝙩𝙖𝙣𝙘𝙚.

In the piece, Vicky shares critical insights on the challenges of maintaining consistent contact resistance (CRES) in parametric testing:

“Parametric testing requires really consistent data, but consistent CRES is also required,” said Vicky. “When a probe touches a pad, debris is generated, and over time that debris builds up on the probe. That leads to higher contact resistance, and if CRES becomes too high or goes out of control, your data is no longer valid.”

She also highlights the importance of proactive maintenance: “Probe tip wear is not always obvious at first, but it shows up as drift in contact resistance. If you only rely on periodic cleaning, you may miss the early stages of degradation. Monitoring touchdown counts and tightening cleaning intervals are the only ways to prevent that drift from turning into data loss.”

Vicky’s expertise continues to shape how the industry approaches probe card reliability and test integrity. Her voice in this article underscores Gel-Pak’s commitment to innovation and precision in semiconductor testing.