Gel-Pak To Showcases Carriers For GAAs And GaN Devices At IMS 2019
HAYWARD, CA, May 28, 2019: Gel-Pak®, a division of Delphon and leading manufacturer of device carriers will showcase its innovative device carrier products designed to safely handle compound fragile GAAs and GaN semiconductor components at the IMS 2019 tradeshow in Boston, MA June 2-7.
The move toward 5G has created a greater need for high-speed, high-efficiency compound semiconductors. Materials used to create these high power devices often include Gallium Arsenide (GaAs), Gallium Nitride (GaN) and Indium Phosphide (InP). These materials tend to be brittle which means greater care needs be taken when handling them. Gel-Pak’s unique ability to immobilize and protect these fragile die and wafers ensures they will remain free from damage during handling. The company’s ample assortment of product configurations and ability to customize device carriers for specific applications make Gel-Pak an ideal choice for compound semiconductor.
Founded in 1980, Gel-Pak has developed a line of proprietary gel and polymer coated device carriers and handling materials that offer solutions for applications where damage during handling must be avoided. The company’s unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Film®, and patented Vacuum Release products. These products effectively immobilize devices during shipping and handling. For further information on Gel-Pak’s product line, please refer to the website at www.gelpak.com.