Driving Efficiency in AI Component Manufacturing

How Gel-Pak Enables Precision Handling for Advanced Optical Transceivers

Overview

A leading global manufacturer in the AI networking space partnered with Gel-Pak to optimize the handling of delicate Chip-on-Carrier (CoC) assemblies and related micro-components during new product introduction (NPI). By implementing Gel-Pak’s VRP Vacuum Release Trays and BTXF Textured Film trays, the customer achieved a secure, clean, and automated workflow for thousands of parts critical to high-bandwidth optical transceivers.

The Challenge

AI transceiver modules integrate ultra-small, high-value components such as ceramic substrates, EML chips, thermistors, and capacitors. These parts require:

  • Stable positioning for vision inspection
  • Controlled release for automated pick-and-place (P&P)
  • ESD safety and silicone-free cleanliness for cleanroom compliance

The Solution

Customized Carrier Strategy

  • VRP Trays: Used for initial vision checks and secure handling of CoCs and other micro-devices. Gel-Pak recommended mesh sizes tailored to component dimensions and adjusted tack levels for optimal release.
  • BTXF Trays: Adopted for subsequent assembly steps. These trays feature a textured film that minimizes contact area (<2%) while maintaining stability. BTXF is silicone-free, ultra-low outgassing, and compatible with automated equipment in multiple formats (2", 4", JEDEC).
  • Universal Fit Advantage: Unlike custom-molded trays that require costly tooling and long lead times, Gel-Pak carriers are universal—accommodating a wide range of component sizes without redesign. This flexibility accelerates NPI and reduces cost.

Automation Integration The customer operates approximately 20 P&P systems, including Datacon and MRSI platforms. Gel-Pak carriers seamlessly integrated into these workflows, supporting efficient load/unload cycles.

Why It Matters for AI

Scaling AI infrastructure depends on high-bandwidth optical transceivers and precision assembly of miniaturized components. Gel-Pak’s carrier solutions enable:

  • Reliable handling during vision inspection
  • Smooth transfers between process stages
  • Cleanroom-ready compliance for contamination-sensitive environments
  • Rapid Deployment Without Custom Tooling:
    Universal-fit carriers eliminate the need for custom trays, reducing engineering overhead and speeding time-to-market for AI hardware.

Key Benefits

  • Release-on-Demand Control: VRP vacuum-release eliminates variability at pick time.
  • Low-Contact Textured Film: BTXF minimizes device contact while ensuring stability.
  • Cleanroom-Ready Materials: Silicone-free and ESD-safe for contamination control.
  • Automation-Friendly Formats: Compatible with existing P&P systems.
  • Universal Fit—No Custom Tooling: Gel-Pak carriers accommodate a wide range of component sizes without the cost and lead time of custom-molded trays.

Impact

  • Improved handling for thousands of CoCs during NPI
  • Reduced risk of damage and contamination during high-precision assembly
  • Accelerated NPI and Lower Costs:
    Eliminating custom tray requirements saved time and expense, enabling faster ramp-up for AI transceiver production.
Case Study Photo