Delphon Announces Partnership with Neu Dynamics Corporation
Contact: Jeanne Beacham
9 A.M. EDT, May 3, 2011
HAYWARD, CA MAY 3, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and insert molding to the Semiconductor, Medical and Automotive industries for over 30 years.
The company plans to combine Neu Dynamics technical expertise with the wide range of applications offered by the Delphon divisions. The alliance between Neu Dynamics and Delphon will provide customers in the Semiconductor and Medical industries with a one-stop solution from product development to production. “This partnership supports our strategy to provide customers in the Semiconductor, Medical and Automotive industries with a single source for complete IC packaging and assembly services; from prototype through production volumes,” says Jeanne Beacham, Delphon President. Kevin Hartsoe, President of Neu Dynamics comments, “This will be a wonderful opportunity for both firms as it allows us to reach more potential customers. The real winners, we believe, will be the marketplace as customers will have a single source supplier for their packaging needs”.
Delphon’s Gel-Pak division manufactures carriers for the shipping, handling and processing of valuable devices. The Quik-Pak division provides packaging and microelectronic assembly services. The TouchMark division provides pad printing and manufacturing services to the Medical Device Manufacturing industry. The UltraTape division manufactures adhesive tapes and labels for critical environments.
For more information Contact: Jeanne Beacham at email@example.com.