Gel-Pak Vacuum Release Carriers for Thin Wafer Handling

Gel-Pak VR carriers are ideal for safely handling thin wafers. These carrier products securely hold fragile wafers in place during shipping and storage. The product line is also routinely used for wafer processing.

Wafer/Large Format VR Plates are ideal for:

• Full or partial wafers and substrates ranging from 75mm to 450mm.
• Applications where contact with top surface or edges must be avoided.
• Diced wafers on film frames.
• Handling thin, high value substrates such as fragile InP wafers, GaAs wafers, AFM wafers, MEMs wafers.