510.576.2220 info@delphon.com

Delphon in the News

Quik-Pak Selected to Provide Enhanced Molding and Assembly Services to Wireless Semiconductor and Solar Customers

April 10, 2014: Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries.

To read full press release, click here


Delphon Partners with Fulham & Co.

April 4, 2014: Delphon, announced today that it has partnered with Fulham & Co. of Wellesley, MA as part of its ongoing expansion strategy. MHT MidSpan acted as exclusive advisor to Delphon, a leading provider of innovative, materials-based solutions and services for the handling, processing, marking, and packaging of high value technology and medical components.

To read the press release, click here.


Delphon Appoints Rajesh Varma to Chief Technology Officer

February 25, 2014: Delphon, a worldwide provider of high-quality, innovative products and services to high-technology companies, today announced the appointment of Rajesh Varma to Chief Technology Officer.

To read the full article, click here.


UltraTape Expands Label Business with Asset Acquisition

October 22, 2013: UltraTape Industries, a division of Delphon and leading manufacturer of cleanroom tape and label products, today announced the acquisition of the assets of a Silicon Valley label business as part of the company’s ongoing expansion of its critical environment label product line.

To read the full article, click here.


Delphon Ranks 17 on List of Largest Women Owned Businesses

October 1, 2013: Jeanne Beacham, CEO of Delphon, a provider of materials and services for the shipping, processing, and packaging of high value semiconductor and medical devices, was recently presented with an award for her leadership role in the womens’ business community.

To read the full article, click here.


Gel-Pak Launches New Interactive Website

July 8, 2013: Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, and telecommunication industries announced the launch of its new interactive website today. The site can be accessed at www.gelpak.com.

To read the full article, click here.


UltraTape Moves to a New Expanded Facility in Wilsonville, OR

June 4, 2013: UltraTape Industries, a division of Delphon, and the premier supplier of Cleanroom tapes and labels has moved to its new 22,000 square foot facility. Located in Wilsonville Oregon, this larger state-of-the-art facility increases UltraTape’s capacity and expands the company’s Class 100 cleanroom manufacturing capabilities.

To read the full article, click here.


UltraTape Industries Announces SubZero Tapes and Labels

March 7, 2013: UltraTape Industries, a division of Delphon, and the premier supplier of Cleanroom tapes and labels announces its SubZero tape and label products designed specifically for application in below freezing conditions.

To read the full article, click here


2013 Semiconductor Viewpoint

January 16, 2013: What will 2013 hold? There are so many viewpoints... Most say it will be the same as 2012 with consumer confidence improving, unemployment remaining high in the 7% range, and low interest rates!

To read the full article, click here


UltraTape Industries Receives 2012 Best of Salem Award

October 10, 2012: UltraTape Industries, a division of Delphon and leading manufacturer of adhesive tapes and labels for cleanroom environments, has been selected for the 2012 Best of Salem Award in the Adhesive Tape category by the Salem Award Program.

To read the full article, click here


Delphon Ranks 23 On List Of Largest Women Owned Businesses

October 1, 2012: Jeanne Beacham, CEO of Delphon, a provider of materials and services for the shipping, processing, and packaging of high value semiconductor and medical devices, was recently presented with an award for her leadership role in the womens’ business community. On September 28, 2012 Delphon Industries was ranked #23 on the San Francisco Business Times’ list of “Largest Women Owned Businesses in the Bay Area.”

To read the full article, click here


Quik-Pak Expands NEW Open-molded Plastic Package (OmPP) Product Family with 8-Lead SOIC

September 18, 2012: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)™ product line.  

To read the full article, click here


TouchMark Expands Medical Device Printing Services

August 16, 2012: TouchMark, a division of Delphon and industry leader in Medical Device Pad Printing, announced today that it has expanded its service offerings to include Screen Printing for both medical and electronics parts. 

To read the full article, click here.


UltraTape Announces Cleanroom Labels for Cryogenic Laboratory Applications

June 13, 2012: UltraTape Industries, a division of Delphon, and the premier supplier of Cleanroom tapes and labels announces its UltraClean Cryogenic Labels, designed specifically for use in controlled environment laboratories. The UltraClean Cryogenic Labels have been tested to -196°C (-320°F) and approved for use on glass slides and plastic vials in liquid nitrogen. 

To read the full article, click here.


Quik-Pak Technical Article: The Right Tool for the Job

May 22, 2012: In this world of shortening product cycles and highly competitive pressures, faster time-to-market is essential. At Quik-Pak, a division of Delphon Industries, they know all too well what it means to "sell time and creativity” in the Semiconductor Industry without compromise to quality or workmanship.

 Read Full Technical Article ›


Gel-Pak Launches Gem Box for Jewelry Market

May 16, 2012: Gel-Pak, the leading manufacturer of Gel-coated boxes, trays and films used by high technology companies for more than 30 years, announced its new line of boxes designed for the Jewelry Industry. 

To read the full article, click here.


Delphon Promotes Darby Davis to Vice President of Sales and Marketing

May 1, 2012: Delphon, a worldwide provider of high-quality, innovative products and services to high technology companies, today announced the promotion of Darby Davis to Vice President, Sales and Marketing. 

To read the full article, click here


Delphon Appoints Rajesh Varma Director of Market and Technology Development

May 1, 2012: Delphon, a worldwide provider of high-quality, innovative products and services to high-technology companies, today announced the appointment of Rajesh Varma to Director of Market and Technology Development. He will support all four of Delphon’s divisions, including Gel-Pak, Quik-Pak, UltraTape, and TouchMark. Rajesh will bring his broad industry background to promote the Delphon’s wide variety of unique materials and solutions to new applications and markets. 

To read the full article, click here


Quik-Pak Technical Article: Gaining Time and Creativity Without Compromise

April 2, 2012: In this world of shortening product cycles and highly competitive pressures, faster time-to-market is essential. At Quik-Pak, a division of Delphon Industries, they know all too well what it means to "sell time and creativity” in the Semiconductor Industry without compromise to quality or workmanship. 

 Read Full Technical Article ›


UltraTape Announces First Cleanroom Certified Barricade Tapes

March 28, 2012: UltraTape Industries, a division of Delphon, and the premier supplier of Cleanroom tape and labels announces its “UltraClean” certified Class 10 (ISO 4) Barricade tape. These non-adhesive barricade tapes are made with a durable polyethylene film on a plastic core and are the first barricade tapes on the market suitable for critical environments. 

To read the full article, click here.  


UltraTape Offers Complete Solution for Label Printing in Clean Environments

March 14, 2012: UltraTape Industries, a division of Delphon, and the premier supplier of Cleanroom tape and labels announces its “UltraClean” certified Class 10 (ISO 4) thermal transfer labels and printer ribbons for use with its UltraLabel PRO cleanroom label printer. These labels and optimized ribbons ensure a contaminate-free printing solution for your cleanroom. 

To read the full article, click here


Quik-Pak Technical Article: The Need for the Open-molded Plastic Package

March 1, 2012: When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts you need when you need them?  If the answer is “no” or “it depends”, then you will clearly understand the value of having open molded plastic packages readily available for quick turn assembly.   

 Read Full Technical Article ›


Delphon Industries Sells ProbeMax™ Product Line to International Test Solutions

February 1, 2012: Delphon Industries today announces the sale of their ProbeMaxTM product line to International Test Solutions, the world leader in probe cleaning technology. International Test Solutions will use the ProbeMax products to enhance their existing probe cleaning and probe polishing business. The two companies, along with Complete Probe Solutions, who was the exclusive ProbeMax worldwide distributor, will work together to assure there is no disruption to the existing customer base during the transition period. 

To read the full article, click here


Quik-Pak Executive Outlook: A Perspective Look at 2012

January 1, 2012: Over the last ten to fifteen years, we have witnessed the disintegration and globalization of the semiconductor supply chain with more manufacturing migrating to Asia. Integrated Device Manufacturers (IDMs) have outsourced their wafer fabrication to Foundries and assembly/test manufacturing to OSATs. The Fabless sector has emerged and flourished with total dependence on these Foundry and OSAT manufacturers. To read the full article, click here.             

 Read Executive Outlook ›


Quik-Pak Announces Copper Wire Bonding Capability

December 15, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. Quik Pak offers copper ball bonding using wires with diameters ranging from 20μm (0.8 mil) to 30μm (1.2 mils). Quik-Pak can support prototype and pre-production volumes. 

To read the full article, click here


Quik-Pak presented at this year's TowerJazz Global Symposium Aerospace and Defense Day

December 14, 2011: Casey Krawiec, Global Sales and Marketing Manager for Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, presented on Aerospace and Defense Day, November 2nd, at the TowerJazz Global Symposium.  The title of his presentation was, "Enabling Innovation".                        

 Read Full Technical Article ›


Now Available: UltraTape Poly TechCut™ Products

October 12, 2011: UltraTape Industries, a division of Delphon and the premier supplier of tapes and labels for critical environments in the Medical/Pharmaceutical, Aerospace, Electronic and Semiconductor industries, announced today its new Poly TechCut™ products. These polyimide film and label products can be custom cut to meet the size specifications of any application. 

To read full article, click here


Jeanne Beacham of Delphon Industries Receives Two Prestigious Awards

October 11, 2011: Jeanne Beacham, CEO of Delphon Industries, a provider of materials and services for the shipping, processing, and packaging of high value semiconductor and medical devices, was recently presented with two separate awards for her leadership role in the womans’ business community. 

To read the full article, click here


Gel-Pak Expands in Southern California

August 30, 2011: Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, photonics, and telecommunication industries, announced today the appointment of CDK Sales Solutions of Simi Valley, CA as its Southern California sales representative. 

To read the full article, click here


Ultratape Announces Sample Kits with Cleanroom Tape Dispenser

July 27, 2011: UltraTape Industries, a division of Delphon and the premier supplier of tapes and labels for critical environments in the Medical/Pharmaceutical, Aerospace, Electronic and Semiconductor industries, announces its convenient adhesive tape sample kits complete with single roll dispenser. 

To read the full article, click here


Quik-Pak Expands New Open-molded Plastic Package (OmPP) Product Family

June 1, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today its exclusive Open-molded Plastic Package (OmPP)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs. 

To read the full article, click here


UltraTape Announces New Gap Sealing Tape for use During Room Sanitization

May 19, 2011: UltraTape Industries, a division of Delphon and the premier supplier of cleanroom tape and labels to the Medical/Pharmaceutical, Aerospace, and Semiconductor industries, announced today the release of its new Gap Sealing Tape designed to eliminate air flow between critical environments and surrounding areas during decontamination processes. 

To read the full article, click here


Delphon Announces Partnership with Neu Dynamics Corporation

May 3, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and insert molding to the Semiconductor, Medical and Automotive industries for over 30 years. 

To read the full article, click here


Gel-Pak Announces a New Battery Operated Hand Held Vacuum Pump

April 28, 2011: Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, and telecommunication industries announced today the GP-PortaVac. The Gp-PortaVac is a light weight, low cost battery operated vacuum pump system for unloading devices from Gel-Pak's Vacuum Release (VR) Trays. 

To read the full article, click here.


Quik-Pak Announces Open-molded Plastic Packages (OmPP)™

April 17, 2011: Quik-Pak’s exclusive Open-molded Plastic Package (OmPP)™ is a pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs. 

For more information visit Quik-Pak


Quik-Pak Offers Innovative Approach to Bumping Single Die

March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping. Gold stud bumping single die, rather than entire wafers, is the preferred approach for prototyping flip-chip assemblies. For product development, prototyping, design validation, and test development, bumping and assembly of small quantities of die is faster and more economical than working with entire wafers. 

To read the full article, click here


UltraTape Offers Complete Solution For Label Printing in Clean Environments

February 9, 2011: UltraTape Industries, a division of Delphon and the premier supplier of Cleanroom tape and labels to the Medical/Pharmaceutical, Aerospace, and Semiconductor industries, announced today the release of the UltraLabel PRO, a desktop label printer designed for critical environment applications. This thermal transfer and direct thermal label printer combined with UltraTape’s cleanroom labels and optimized ribbons make it a one-stop shop for your production label needs. 

To read the full article, click here


TouchMark Developes New Printing Process Using Conductive Inks

January 6, 2011: TouchMark a division of Delphon Industries and industry leader in Medical Device Pad Printing, announced today the development of a printing process for medical applications using conductive inks. Conductive ink is ideal for applications including medical electrodes, static elimination, EMI/RFI shielding and membrane switches.

To read the full article, click here


Quik-Pak Enhances Die Bonding Capabilities

November 17, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its services to include submicron placement accuracy as part of its flip chip bonding capabilities. The company recently added the Finetech FINEPLACER® Lambda to address the needs of customers who require precise placement, die attach and advanced packaging including thermo-compression and thermo-sonic bonding. 

To read the full article, click here


Quik-Pak Expands Wire Bonding Capabilties

November 12, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its already robust wire bonding services with new state-ofthe- art K&S equipment. This new equipment is capable of handling wire diameters from 0.7 mil (18μm) to 3.0 mils (76μm) and bond pad pitch down to 35 microns. 

To view the full article, click here


TouchMark Develops Pad Printing Process for Microcatheters

November 11, 2010: TouchMark, a division of Delphon Industries and leader in medical device pad printing, announced today that it has developed a process for high resolution printing on microcatheters with diameters as small as 8 mils (203μm). Working directly with medical device manufacturers who specialize in designing microcatheters, TouchMark has created a solution for providing crisp, permanent markings on even the smallest tube diameter. 

To read the full article, click here


Quik-Pak hosts IMAPS Presentation on the challenges of die stacking

October 26, 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps between the wires, die, and components used in the RF modules.

Mark Kuhlman a Senior Principal Engineer at Skyworks Solutions led the presentation. http://www.imaps.org/

Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies

September 25, 2008: Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector arrayprocessing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services. 

To read the full press release, click here


GSA Suppliers Expo Provides Optimal Opportunity for the Semiconductor industry to View Innovative Solutions from Quik-Pak

September 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will exhibit at the upcoming GSA Suppliers Expo October 2, 2008. The company plans on showing conference attendees its full turnkey solutions for their IC packaging and prototyping needs. Quik-Pak, offers IC packages, assembly and prototype services. 

To read the full press release, click here.


UltraTape Extends Special Discount on Tape Products through December 31, 2008 

August 14, 2008: UltraTape Industries, a division of Delphon Industries and manufacturer of adhesive tapes for critical environments, will extend its special discount program (up to 30%) on its white one and two-inch polyethylene and vinyl tapes through December 31, 2008. 

To read the full press release, click here


Gel-Pak Offers New Website Tool for Customers

July 31, 2008: Gel-Pak, a division of Delphon Industries and leading manufacturer of Gel-coated carriers for device shipping, handling, and processing announced today the launch of its new web-based Device Calculator Tool. This tool allows customers to compute the number of their specific devices that can be loaded on a particular Gel-Pak carrier. 

To read the full press release, click here.


Gel-Pak Appoints New National Sales Manager

July 31, 2008: Gel-Pak, a division of Delphon Industries and leading manufacturer of Gel-coated carriers used for device shipping, handling and processing, announced today the appointment of Jasmine Ihua Shih to the position of National Sales Manager. Ms. Shih will report directly to Darby Davis, Director of Worldwide Sales and Marketing. She will be responsible for managing the company’s national sales effort as well as developing new vertical markets.

To read the full press release, click here


UltraTape Announces a Discount of up to 30% on Select Tapes from now until September 30, 2008

June 26, 2008: UltraTape Industries, a division of Delphon Industries and manufacturer of adhesive tapes for critical environments, is offering a discount of up to 30% on it's vinyl and polyethylene white tape.

To read the full press release, click here.


IC Design, Packaging and Prototyping Firms Partner To Service Customers in Europe

May 5, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will partner with UK based Optocap limited to provide European customers with a full turnkey solution for their IC packaging and prototyping needs. The two companies will co-exhibit at the upcoming IET & GSA International Semiconductor Forum in London, England May 14-15.

To read the full press release, click here


IC Design, Packaging and Prototyping Firms Partner To Service Customers in the UK

May 1, 2008: Quik-Pak, a division of Delphon Industries, announced today that it will partner with Optocap of Scotland to service customers in the UK. To that end, the two companies will co-exhibit at the upcoming IET & GSA International Semiconductor Forum in London, England May 14-15.

To read the full press release, click here


Quik-Pak Awarded Large Mil Spec Contract

April 24, 2008 Quik-Pak, a division of Delphon Industries, announced today that it has been awarded a large contract for wafer dicing, pick-and-place, and visual inspection completed to Military Specification 883.

To read the full press release, click here


UltraTape Announces Sample Kits Available for Purchase Through Website

April 21, 2008: UltraTape Industries, a division of Delphon Industries and manufacturer of adhesive tapes for critical environments, announced today the availability of sample kits for purchase through their website.

To read the full press release, click here.


TouchMark Attains ISO 9001 : 2000 Certification

March 28, 2008: TouchMark, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its precision pad printing services.

To read the full press release, click here.


Quik-Pak Attains ISO 9001 : 2000 Certification

March 28, 2008: Quik-Pak, a division of Delphon Industries, announced today that it has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly andprototyping services.

To read the full press release, click here


Jeanne Beacham Honored with Two San Francisco Bay Area Leadership Awards

March 3, 2008: Jeanne Beacham, CEO of Delphon Industries, a provider of materials and services for the shipping, processing, and packaging of high value technology components, was recently presented with two separate awards for her leadership role in the woman’s business community. 

To read the full press release, click here


Gel-Pak Announces Agreement with A.V.B.A. Hitech

February 12, 2008 Delphon Industries' Gel-Pak division announces distribution agreement with A.V.B.A. Hitech Ltd. of Israel.

To read the full press release, click here.


Gel-Pak Announces Agreement with TELTEC

February 12, 2008 Delphon Industries' Gel-Pak division announces distribution agreement with TELTEC.

To read the full press release, click here.


Gel-Pak Announces Agreement with Smart Materials & More

February 12, 2008 Delphon Industries' Gel-Pak Divisions announces distribution agreement with Smart Materials and More of the Netherlands.

To read the full press release, click here


Quik-Pak Installs New Ultra-fine Pitch Wire Bonder

January 31, 2008: Delphon Industries' Quik-Pak division Installs New UItra-Fine Pitch Wire Bonder.

To read the full press release, click here.


Gel-Pak Announces Agreement with New European Distributors

January 20, 2008: Delphon Industries' Gel-Pak division announces agreements with three new European Distributors. A.V.B.A., Smart Materials and More, and TELTEC will service Gel-Pak customers in Europe and Israel.

To read the full press release, click here


TouchMark Installs New Vision System

December 11, 2007 Delphon Industries' TouchMark adds new high-tech vision system.

To read the full press release, click here


KeithTaft to Manage UltraTape Industries

September 13, 2007 Delphon Industries Names Keith Taft as its UltraTape division's General Manager.

To read the full press release, click here


Delphon Ranked in Top 100 Bay Area Women Owned Businesses

September 21, 2007 Delphon Industries Ranked 29 in Top 100 Bay Area Women Owned Businesses 

To read the full press release, click here


Jeanne Beacham speaks at the Woman's Technology Leadership Forum

September 19, 2007 Jeanne Beacham will be speaking tonight at the Women's Technology Leadership Forum, an evening of networking and education at Jazz Semiconductor, put on by the The Association for Women in Technology (AWT). The event features women in leadership roles at Top, Innovative companies. Christie Brockhage of Business Wire will serve as moderator for the evening's open question and answer format.


Quik-Pak adds Backgrinding Services

August 21, 2007: Delphon Industries' Quik-Pak division announces new backgrinding services to its existing.

To read the full press release, click here


Quik-Pak Announces New Manufacturing Engineer

August 1, 2007: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring David Arciaga, as Manufacturing Engineer.

 To read the full press release, click here


Quik-Pak Announces New BGA Service

August 1, 2007: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the hiring of Matt Rackstein, as Applications Engineering Manager. Mr. Rackstein brings with him a wealth of expertise in the field of design engineering and MEMS (Mirco Electro Mechanical Systmes) Development.

To read the full press release, click here


Delphon Announces Acquisition of UltraTape

June 26, 2007: Today, Delphon Industries announced its acquisition of UltraTape Industries of Salem, Oregon. 

To read the full press release, click here.  


TouchMark Relocates

May 21, 2007: TouchMark, a leading provider of high quality precision pad printing services to the medical device, diagnostic, and consumer electronics industries, moved to its new high-tech facility today.

To read the full press release, click here


Delphon Receives Best Practices Award

May 2, 2007: Delphon Industries, a provider of materials and services for the shipping, processing, and packaging of high value technology components, was presented with an award for Outstanding Efforts to Foster Employee Health and Well-Being While Enhancing Organizational Performance by the California Psychological Association.

To read the full press release, click here


Jeanne Beacham Speaks at Association for Operations Management

May 1, 2007: Jeanne Beacham is the featured speaker at the Association for Operations Management, Mission Peak chapter May, 2nd meeting.
www.apicsmissionpeak.org/


Gel-Pak Unveils Chinese Website

April 17, 2007: Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, and telecommunication industries announced the launch of its new Chinese-Language website today. The site was developed in order to more effectively compete in the fast growing Chinese semiconductor and photonics markets.

To read the full press release, click here.  


Quik-Pak Installs Ball Grid Array Process

April 11, 2007: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new process line for Ball Grid Array(BGA)sphere attach.

To read the full press release, click here


Gel-Pak Announces Product Selection Wizard

March 27, 2007: Gel-Pak, a division of Delphon Industries, announced the launch of its new web-based Product Selection Wizard (PSW), an interactive program that uses a series of targeted questions to recommend the ideal Gel-Pak® carrier based on each customer's detailed application. The product selection wizard is available through the company's website.

To read the full press release, click here.


Gel-Pak Signs Distribution Agreement with Fixeon

March 14, 2007: Gel-Pak, a division of Delphon Industries, announced today the signing of a distribution agreement with Fixeon of Austin, TX. Gel-Pak is pleased to offer the Fixeon wafer shippers which expand Gel-Pak's carrier product line and is synergistic with its die handling products.

To read the full press release, click here


TouchMark Launches New Website

February 21, 2007: TouchMark, a leading provider of high quality precision pad printing services to the medical device, diagnostic, and consumer electronics industries, launched its new website.

To read the full press release, click here


Jeanne Beacham Featured in Ad Campaign

November 29, 2006: Jeanne Beacham, CEO of Delphon Industries was recently featured in an Advertisement for the law firm Sedgwick, Deter, Moran & Arnold. The ad salutes Ms. Beacham as a women trailblazer who understands the challenge of competition, the importance of teamwork and the satisfaction of success.

To read the full press release, click here


Quik-Pak Installs New Disco Wafer Dicing Saw

October 31, 2006: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new 200mmm Disco Automatic Wafer Dicing Saw in it's recently expanded facilities in San Diego.

To read the full press release, click here


Quik-Pak Adds 5,000 SF to Current Facility

September 6, 2006: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced that construction is underway for a 5,000 square foot expansion of its currentfacilities.

To read the full press release, click here


Delphon Featured in Wall Street Journal

August 9, 2006: Delphon featured in Wall Street Journal Article regarding offshore manufacturing vs. manufacturing in the US. 

To read the full press release, click here


Gel-Pak Appoints New Distributor in Taiwan

August 1, 2006:Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, and telecommunication industries announced today the appointment of Michael Yeng of Silicon Connection as the company’s sales distributor in Taiwan.

To read the full press release, click here


Jeanne Beacham Speaks at NAWBO

January 17, 2006: Jeanne Beacham will be speaking this month at a NAWBO event.


Delphon Acquires TouchMark

January 10, 2006: Delphon Industries announced its acquisition of TouchMark, a provider of high quality pad printing services.

To trad the full press release, click here


Gel-Pak Announces New European Distributor

January 8, 2006:Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, and telecommunication industries announced today the appointment of TELTEC as its new European distributor.

To read the full press release, click here


Gel-Pak Celebrates 25 Years of Protecting the World's Valuable Devices

November 1, 2005:Gel-Pak, a division of Delphon Industries and leading manufacturer of device shipping and handling carriers used predominantly by the semiconductor, optoelectronics, telecommunication, and medical industries announced it’s 25th anniversary today.

To read the full press release, click here


Packaging Technologies Firm Invests in New Venture

September 23, 2005: Delphon Industries announced its investment in Infixeon, LLC of Austin, TX today. The move was part of an ongoing strategy to merge innovative packaging technologies in order to provide unique materials and services for the shipping, processing, and packaging of high value technology components.

To read the full press release, click here


Jeanne Beacham gives commencement speech at Northwestern University

June 18, 2005: Jeanne Beacham gave the commencement speech for the 2005 graduation class of Northwestern University's McCormick School of Engineering and Applied Science.

To read the full press release, click here.


Jeanne Beacham Honored as “A Woman of Distinction in Technology”

May 12, 2005: Jeanne Beacham, Delphon Industries' CEO was featured in the May 16 edition of Silicon Valley/San Jose Business Journal.

As part of their In Depth: Women of Distinction series, Beacham was credited for her ability to "communicate plainly" in the world of IT and engineering, while helping Delphon "bring in about $10 million in sales" this year.

Along with running the company, Jeanne is also the president of the Silicon Valley Chapter of the National Association of Women Business Owners, founder of the Semiconductor Women's Alliance Network, among other organizations.

The article also gave kudos to Delphon's growth and its branching out from a family run business to a firm with 78 employees. 

   Read Full Article ›


Jeanne Beacham Featured Author in San Jose Business Journal

October 1, 2004:Jeanne Beacham is a featured author in Silicon Valley/San Jose Business Journal. Title of the article: Finding the right financing can be a tricky business. 

 Read Full Article ›

Current Events

Quik-Pak
Del Mar Electronics
April 30 - May 1
San Diego, CA

TouchMark
MD&M Texas
May 7-8
Fort Worth, TX

Quik-Pak
CS Mantech
May 19-22
Denver, CO

More Events...