510.576.2220      info@delphon.com

Delphon Divisions

Gel-Pak When companies need to handle, transport, or process small, valuable devices without risk of damage, they rely on Gel-Pak. Working across a number of industries, Gel-Pak has been creating innovative solutions for the safe handling and shipping of leading edge technologies for over twenty-five years.

Gel-Pak has over 1,000 active customers worldwide, ranging from Fortune 500 companies to small startup manufacturers and universities. Key industries that rely on Gel-Pak’s one-of-a-kind products include semiconductor, optoelectronic, microwave, telecommunication, medical, automotive and data storage.

Headquartered in Hayward, California, Gel-Pak has been manufacturing families of innovative packaging products since 1980.

TouchMark TouchMark has provided high quality precision pad printing and manufacturing services to the medical device, diagnostics, and electronics industries for over 15 years. The company’s cleanroom manufacturing facility enables it to handle prototypes ranging from small clinical trial and engineering lots to large production volumes all with the quickest possible turn-around time.

TouchMark’s pad printing technology was developed by servicing the demanding needs of the medical device and electronic components industries. Projects can vary from precision catheters to keyboard pads with unique recessed areas and compound curves. TouchMark’s expertise in printing on difficult substrates range from PEEK, Delrin, Polypropylene, and PTFE to Silicone.

Quik-Pak Quik-Pak, specializes in advanced IC Assembly and Prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers Packaging and Assembly services in 24 hours or less. Quik-Pak also offers complete Wafer & Die Preparation services, including Backgrinding, Dicing, Bumping, Pick & Place and Inspection.

The company’s Advanced Assembly services meet the unique requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMS devices. Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking. Quik-Pak’s Laser Micromachining capability creates vast opportunities for package customization through drilling, cutting and marking of almost any material. Quik-Pak is the ideal partner for Advanced IC Assembly and Prototyping, providing unparalleled flexibility, quality and outstanding customer service.

Ultratape UltraTape has been manufacturing high quality Adhesive Tapes for the Semiconductor, Pharmaceutical, Aerospace, Medical and electronics’ industries for over 15 years. The company’s Clean Room manufacturing facility assures Particle-Free and Residue Free Adhesive tapes in rolls ranging from small engineering lots to large production volumes.

UltraTape’s wide variety of tape includes substrates such as Polyester, Polyethylene, PVC, Polypropylene, Kapton, Polyimide and utilizes the optimum adhesive technologies whether Acrylic, Rubber, or Polyurethane for each application.

UltraTape’s proprietary process was developed to meet the needs of the high technology industries. Ultratape can uniquely provide CleanRoom Certified tape to meet critical industries requirements. Applications ranging from Cleanroom construction tape, wafer process tape, barrier tapes or sterilization.

History

Delphon’s mission is to provide materials and services for the shipping, processing, printing, and packaging of high value technology and medical components. Headquartered in Hayward, California, CEO Jeanne Beacham has aggressively positioned Delphon to take advantage of changes within the industries the company serves.

With divisions Gel-Pak, Quik-Pak, TouchMark and UltraTape along with a worldwide sales and distribution network, Delphon Industries serves a wide range of markets.